IPC/JEDEC J-STDC. Handling, Packing,. Shipping and Use of. Moisture/ Reflow. Sensitive Surface. Mount Devices. A joint standard. IPC/JEDEC J-STDC-1 -. August IPC/JEDEC J-STDC -. February IPC/JEDEC J-STDB.1 includes Amendment 1 -. complies with ipc/JEDEc J-stDA. 3M™ HIC this card meets the IPC /JEDEC J-STD-. A standard. card size: 2” x 3” inches indicates: 5,10,15%.
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They were subjected to two different storage conditions: Please first log in with a verified email before subscribing to alerts.
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J-STD Bake Conditions
The key parameter in blistering of connector housings is the control of moisture absorption in the molded parts. The vapor pressure of moisture and other gases trapped inside the walls of a plastic connector increase rapidly when the connector is exposed to the high jpc of solder reflow. If all moisture absorption precautions are taken and connectors wtd still exhibiting some delamination jesec SMT assembly, measuring the amount of moisture in the parts to determine the steps jevec to solder without connector blistering may be required.
All techniques provided similar moisture percentages in parts. Table 3 shows that, at the storage conditions of an air-conditioned warehouse in Southeast Asia Condition 1even the thinnest tested LDPE bag would provide enough moisture protection to keep the connectors below the blister threshold level for 90 days.
This delamination is commonly referred to as a “blister. Many Asian OEMs, who have been converting to the lead-free solder process for the last few years, require that their connectors be packaged to minimize moisture absorption for this reason.
Please first verify your email before subscribing to alerts. As the voice of the U. Some materials currently ilc may deform melt or show signs of delamination on the side walls, referred to as “blistering. Your Alert Profile lists the documents that will be monitored. MBBs in two different thicknesses 0.
If the document is revised or amended, you will be notified by email. For standard MBB sizes used for shipping connectors loose or on reels the amount of desiccant required is less than two units. Figures 1 and 2. Board assemblers have focused on handling more expensive ICs but have failed to take similar precautions with board connectors. The company has analyzed the types of bags that are available for connector packaging and come up with some recommendations based upon WVTR ratings Table 2.
Key to elimination of blistering is moisture control for most of the temperature-capable engineering resins used in connector housings. Subscription pricing is determined by: BoxEvansville, IN; Fax: The higher preheat temperatures typical in lead-free solder profiles may provide more safety from blistering for thinner-walled parts than current tin-lead solder profiles due to the direct relationship between moisture desorption rate and temperature.
Many connector suppliers are eliminating, or have already eliminated, lead from their contact plating process. In this stage, the higher liquidus temperatures required for lead-free solders may have a profound effect on the connector insulator housings.
But the problems listed previously for connectors in these hot oven environments can also result in board rework. Blister onset temperature is dependent upon several factors, including wall thickness, percentage of moisture in the part, speed of connector heating, and peak temperature of the reflow process.
The next phase will be lead-free solder compliance for board assembly. Approved options include clay and silica gel. This standard is not included in any packages. Standards Subscriptions from ANSI provides a money-saving, multi-user solution for accessing standards. Effectiveness of desiccant on moisture absorption of packaged connectors. Already Subscribed to this document. You may delete a document from your Alert Profile at any time. Higher temperatures required for lead-free SMT soldering will force a change from many currently used connector housing resins, which will melt, suffer pin retention failures or fail to meet dimensional stability requirements.
Minimizing Effects of Lead-free SMT Assembly on Connector Housing Resins
These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. The company compared three moisture measurement jeeec By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life of 12 months from the seal date when using sealed dry bags.
Lead-free solders result in higher peak temperatures, meaning more blistering. We have no amendments or corrections for this standard.
You can download and open this file to your own computer but DRM prevents opening this file on another computer, including a networked server. The higher the peak temperature, the lower the moisture content can be i;c blistering.
For ease of use, the halogen moisture analyzer was considered the best.